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2026/7/28
Growing demand from AI servers, high-voltage power architectures, vehicle electrification, and industrial automation, combined with geopolitical developments and supply chain restructuring, has gradually shifted the Power semiconductors industry toward a seller’s market. This article examines the major power semiconductor product categories, end-use applications, and competitive landscape, while exploring how AI is driving higher demand for components such as MOSFETs, IGBTs, and SiC devices. It also assesses how Taiwanese suppliers, including PANJIT and APEC, may benefit from supply chain realignment.
# Stocks
# Taiwan
# Manufacturing Industry
# Semiconductors
# Electronics
# AI
# Automotive
2026/7/2
As computing power requirements for AI and HPC chips continue to rise, advanced packaging is shifting from wafer-level packaging toward panel-level packaging (PLP). This article explains PLP’s core technologies, the advantages of glass substrates and through-glass via (TGV) processes, and the differences between FOPLP and mainstream packaging technologies such as FOWLP, CoWoS, CoPoS, and EMIB. It also explores how demand for AI GPUs, chiplets, and heterogeneous integration is driving PLP market growth, while analyzing its future opportunities and technical challenges across the advanced packaging supply chain. Finally, this article highlights Taiwan's key companies involved in PLP technology and discusses their future outlook.
2026/6/14
The Trump administration is shifting toward Section 301 as the foundation for a new long-term tariff framework. The Office of the United States Trade Representative (USTR) has proposed additional tariffs ranging from 10% to 12.5% on 60 economies, covering most goods imported into the United States, while maintaining exemptions for semiconductors, energy products, medical goods, and critical minerals. This article summarizes the latest developments regarding the proposed Section 301 tariffs, the scope of exempt products, and the potential implications for Taiwan, China, Vietnam, Japan, and global supply chains. It also examines the future direction of Trump's tariff policy and the challenges businesses may face.
# USA
# China
# Consumer Discretionary
# Life Sciences
# Basic Materials
# Basic Industries
# Energy
2026/6/2
NVIDIA GTC 2026 showcased a pivotal transition in the AI industry from Generative AI to Agentic AI. From the Vera Rubin platform and DSX AI Factory to the Agent Toolkit and Physical AI ecosystem, NVIDIA is accelerating the development of a comprehensive AI infrastructure spanning data centers, enterprise applications, personal computers, and robotics, offering a glimpse into the next wave of growth in AI computing and the semiconductor industry.
This article summarizes the key takeaways from the Technology Symposium, analyzes future trends in advanced process technologies, packaging innovations (CoWoS, SoIC, and SoW), and the AI supply chain, and explores the long-term growth drivers of the semiconductor industry. TSMC continues to drive improvements in AI chip performance and innovation in system integration.
2026/5/5
As AI chip power consumption rises rapidly, GPU server cooling technology is shifting from traditional air cooling to direct liquid cooling, and further evolving toward Micro Channel Cold Plate (MCCP) and Micro Channel Lid (MCL) architectures. This article explains the technical limits of air cooling, liquid-to-air, and liquid-to-liquid cooling, while exploring how MCCP improves heat exchange efficiency and how MCL breaks through the TIM2 bottleneck by shortening the thermal transfer path. The article also discusses opportunities across the thermal management supply chain and the competitive advantages of key beneficiaries.
2026/4/16
As the importance of cooling systems has increased significantly, chip-level cooling emerging has also become a critical technology. This article focuses on advancements in TIM 2 materials and the development of gold-plated cold plates, explaining how the introduction of indium improves thermal efficiency while also creating chemical reaction challenges. Amid the trend, Taiwanese companies—such as Superior Plating Technology (8431.TW) —are well-positioned to enter the supply chain and capture new opportunities driven by AI server cooling upgrades.
2026/4/14
Grab’s $600 million acquisition of foodpanda’s Taiwan business has become one of the most closely watched deals in the food delivery sector in recent years. The transaction not only reflects Delivery Hero’s strategic asset restructuring under capital pressure, but also marks Grab’s official expansion beyond Southeast Asia into East Asia. As the market structure is set to evolve, Taiwan’s delivery industry may shift from a duopoly toward competition between diversified ecosystems, with the competitive focus moving away from price subsidies to platform integration, user experience, and long-term profitability.
# Southeast Asia
# Service Industry
# Technology
2026/4/8
The optical communications industry is shifting from traditional telecom cycles to structural growth driven by AI data center demand. As AI clusters expand and high-performance computing requirements increase, key technologies such as 800G and 1.6T optical transceivers, silicon photonics, and co-packaged optics (CPO) are accelerating adoption, driving upgrades across the entire industry chain. With capital expenditures continuing to rise, optical communications is becoming a core pillar of AI infrastructure, though supply bottlenecks and geopolitical risks remain key factors to watch.
# Communication Services
2026/4/2
Driven by demand for AI, cloud computing, and high-performance computing, the U.S. semiconductor industry is entering a new growth cycle. This article provides a comprehensive breakdown of the global market size, industry value chain, and key segments—including IP/EDA, IC design, equipment, and foundries—while incorporating the 2026 outlook and potential risks to help investors understand core industry trends and investment logic.
# Africa
# Monetary Policy
