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2026/7/28
Growing demand from AI servers, high-voltage power architectures, vehicle electrification, and industrial automation, combined with geopolitical developments and supply chain restructuring, has gradually shifted the Power semiconductors industry toward a seller’s market. This article examines the major power semiconductor product categories, end-use applications, and competitive landscape, while exploring how AI is driving higher demand for components such as MOSFETs, IGBTs, and SiC devices. It also assesses how Taiwanese suppliers, including PANJIT and APEC, may benefit from supply chain realignment.
# Stocks
# Taiwan
# Manufacturing Industry
# Semiconductors
# Electronics
# AI
# Automotive
2026/7/16
Apple's decision to raise prices for products including Macs and iPads reflects more than just a pricing strategy—it highlights the growing cost pressures created by the global imbalance between memory supply and demand. This article examines the key drivers behind the sharp increase in DRAM and NAND prices, including AI-driven demand for HBM and enterprise SSDs, the concentrated supply among the three leading memory manufacturers, the rapid rise of Chinese memory makers, and Apple's strategic evaluation of Chinese suppliers. It also explores how developments in the memory industry are reshaping the consumer electronics market and the future competitive landscape of the global supply chain.
# China
# USA
2026/7/8
An antitrust lawsuit against Samsung, SK hynix, and Micron has been accepted, alleging that the three leading memory manufacturers shifted production capacity from conventional DRAM to higher-margin HBM in response to booming AI demand. The plaintiffs claim this strategy has contributed to a roughly 700% increase in DRAM prices over the past four years. This article examines the key issues surrounding the lawsuit, explains how HBM capacity expansion is affecting memory supply and demand, and explores the oligopolistic structure of the DRAM market, the drivers behind soaring memory prices, and the potential implications for the memory industry and the broader AI supply chain.
2026/7/2
As computing power requirements for AI and HPC chips continue to rise, advanced packaging is shifting from wafer-level packaging toward panel-level packaging (PLP). This article explains PLP’s core technologies, the advantages of glass substrates and through-glass via (TGV) processes, and the differences between FOPLP and mainstream packaging technologies such as FOWLP, CoWoS, CoPoS, and EMIB. It also explores how demand for AI GPUs, chiplets, and heterogeneous integration is driving PLP market growth, while analyzing its future opportunities and technical challenges across the advanced packaging supply chain. Finally, this article highlights Taiwan's key companies involved in PLP technology and discusses their future outlook.
As Automate 2026 Chicago highlighted the next phase of smart manufacturing, with Physical AI emerging as the driving force behind industry transformation. From the development paths of wheeled and bipedal humanoid robots, to NVIDIA's Halos for Robotics safety system, as well as advances in simulation-first design, digital twins, AI vision, robotic touch sensing, and collaborative robots, the exhibition demonstrated that industry competition is no longer centered solely on hardware performance. Instead, it has expanded to include AI capabilities, hardware-software integration, and ecosystem development, making the event a key indicator of future trends in smart factories and industrial automation.
2026/6/24
Rapid growth in AI server demand is driving the passive components industry beyond its traditional inventory cycle and into a phase of structural growth. On the supply side, capacity expansion for high-end products remains limited, while longer lead times and ongoing price increases continue to emerge, pushing the industry firmly into a seller's market. This article examines how AI servers are reshaping the supply-demand dynamics of the passive components industry and explores the opportunities for Taiwanese companies such as Yageo and Holy Stone Enterprise.
2026/6/17
As demand for AI servers continues to surge, passive components have evolved from supporting components into a key area of market focus. From MLCCs and resistors to power inductors, these fundamental electronic components play a critical role in ensuring the stable operation of AI servers, GPUs, and high-speed data transmission systems. This article explores the major categories of passive components, their functions, and industry trends, while examining how the AI boom is creating opportunities for specification upgrades and long-term structural growth across the passive components industry.
# Editor's Pick
2026/6/14
The Trump administration is shifting toward Section 301 as the foundation for a new long-term tariff framework. The Office of the United States Trade Representative (USTR) has proposed additional tariffs ranging from 10% to 12.5% on 60 economies, covering most goods imported into the United States, while maintaining exemptions for semiconductors, energy products, medical goods, and critical minerals. This article summarizes the latest developments regarding the proposed Section 301 tariffs, the scope of exempt products, and the potential implications for Taiwan, China, Vietnam, Japan, and global supply chains. It also examines the future direction of Trump's tariff policy and the challenges businesses may face.
# Consumer Discretionary
# Life Sciences
# Basic Materials
# Basic Industries
# Energy
2026/6/2
NVIDIA GTC 2026 showcased a pivotal transition in the AI industry from Generative AI to Agentic AI. From the Vera Rubin platform and DSX AI Factory to the Agent Toolkit and Physical AI ecosystem, NVIDIA is accelerating the development of a comprehensive AI infrastructure spanning data centers, enterprise applications, personal computers, and robotics, offering a glimpse into the next wave of growth in AI computing and the semiconductor industry.
This article summarizes the key takeaways from the Technology Symposium, analyzes future trends in advanced process technologies, packaging innovations (CoWoS, SoIC, and SoW), and the AI supply chain, and explores the long-term growth drivers of the semiconductor industry. TSMC continues to drive improvements in AI chip performance and innovation in system integration.
# Technology
# Communication Services
