- Industry
What Is Backside Power Delivery Network (BSPDN)? The Technological Differences Among TSMC, Samsung, and Intel
As Moore’s Law approaches its physical limits, the bottleneck in chip scaling is no longer confined to transistors—it increasingly lies in power delivery. Traditional front-side power delivery networks (FSPDN) ultimately constraining performance and power efficiency.To sustain progress in advanced process nodes, TSMC, Intel, and Samsung have each moved forward with backside power delivery network (BSPDN) technologies. This article analyzes the fundamentals of backside power delivery, introduces TSMC’s Super Power Rail (SPR), and compares it with Intel’s PowerVia and Samsung’s BSPDN solutions. It further explores two critical steps in implementing backside power delivery—wafer thinning and reclaimed wafers—and examines how these technological shifts could reshape the market and supply chain.
- Industry
What Are Passive Components? A Complete Guide to MLCCs, Capacitors, Resistors, Inductors, and Industry Trends
As demand for AI servers continues to surge, passive components have evolved from supporting components into a key area of market focus. From MLCCs and resistors to power inductors, these fundamental electronic components play a critical role in ensuring the stable operation of AI servers, GPUs, and high-speed data transmission systems. This article explores the major categories of passive components, their functions, and industry trends, while examining how the AI boom is creating opportunities for specification upgrades and long-term structural growth across the passive components industry.
- Industry
What is WMCM? A New Technology for the 2nm Era?
As the industry advances toward the 2nm process node, WMCM has emerged as a key focus in advanced packaging. This article explores WMCM’s core technology principles, process architecture, and its differences compared with InFO and CoWoS. It also analyzes its advantages and limitations in high-density RDL, thermal performance, cost, and integration flexibility, and highlights key Taiwanese beneficiaries in the materials and equipment supply chain.
- Industry
What Is Backside Power Delivery Network (BSPDN)? The Technological Differences Among TSMC, Samsung, and Intel
As Moore’s Law approaches its physical limits, the bottleneck in chip scaling is no longer confined to transistors—it increasingly lies in power delivery. Traditional front-side power delivery networks (FSPDN) ultimately constraining performance and power efficiency.To sustain progress in advanced process nodes, TSMC, Intel, and Samsung have each moved forward with backside power delivery network (BSPDN) technologies. This article analyzes the fundamentals of backside power delivery, introduces TSMC’s Super Power Rail (SPR), and compares it with Intel’s PowerVia and Samsung’s BSPDN solutions. It further explores two critical steps in implementing backside power delivery—wafer thinning and reclaimed wafers—and examines how these technological shifts could reshape the market and supply chain.
- Industry
What Are Passive Components? A Complete Guide to MLCCs, Capacitors, Resistors, Inductors, and Industry Trends
As demand for AI servers continues to surge, passive components have evolved from supporting components into a key area of market focus. From MLCCs and resistors to power inductors, these fundamental electronic components play a critical role in ensuring the stable operation of AI servers, GPUs, and high-speed data transmission systems. This article explores the major categories of passive components, their functions, and industry trends, while examining how the AI boom is creating opportunities for specification upgrades and long-term structural growth across the passive components industry.
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- Industry
2026/7/28
Power Semiconductors: How AI and Supply Chain Restructuring Are Reshaping the Industry
Growing demand from AI servers, high-voltage power architectures, vehicle electrification, and industrial automation, combined with geopolitical developments and supply chain restructuring, has gradually shifted the Power semiconductors industry toward a seller’s market. This article examines the major power semiconductor product categories, end-use applications, and competitive landscape, while exploring how AI is driving higher demand for components such as MOSFETs, IGBTs, and SiC devices. It also assesses how Taiwanese suppliers, including PANJIT and APEC, may benefit from supply chain realignment.
- News
2026/7/27
fiisual Biweekly Oil Report :Rising US-Iran Tensions Push Up Oil Prices; Reports of Renewed Talks Emerge, but Red Sea Risks Continue to Lift the Oil Risk Premium
Over the past two weeks, international oil prices have swung sharply amid escalating US-Iran conflict, with Brent crude briefly breaking above $100. In the early stage of the conflict, US-Iran military confrontation expanded into the Persian Gulf region, and the Houthi movement's involvement in the Red Sea situation raised market concerns that the Strait of Hormuz and the Bab-el-Mandeb Strait could form a "dual-strait crisis," pushing up the oil risk premium. However, with Pakistan actively mediating under Chinese backing, prospects for a resumption of US-Iran talks have improved, and with the US having refrained from new military action against Iran for the past two to three days, the market has grown hopeful of a diplomatic cooldown, causing oil prices to pull back from their highs. On the fundamentals side, the Strategic Petroleum Reserve (SPR) continues to decline, shrinking the buffer available to the market. Overall, short-term oil prices remain dominated by elevated geopolitical risk, and the market will continue to focus on the progress of US-Iran talks and whether Red Sea shipping risks expand further. If diplomatic talks achieve a breakthrough, the risk premium could continue to ease; but if talks collapse or the risk of strait blockades rises, oil prices may again face upward pressure.
- Financials
2026/7/20
What Are GPU Compute Futures? The Next Step in the Financialization of AI Computing Power
As demand for AI model training continues to surge, GPU computing power is evolving from a technology resource into a standardized, tradable asset, paving the way for the emergence of GPU compute futures. This article explains how GPU compute futures work, their role in hedging and risk management, and the value they bring to the market. It also explores how AI developers, data center operators, and financial institutions can use futures contracts to manage fluctuations in compute pricing, while highlighting the latest initiatives from exchanges such as CME Group and Intercontinental Exchange (ICE). Discover how the financialization of computing power is shaping the next frontier of the AI economy.
- Industry
2026/7/16
Why Is Apple Raising Prices? AI-Driven Memory Costs Are Creating New Challenges for the Global Supply Chain
Apple's decision to raise prices for products including Macs and iPads reflects more than just a pricing strategy—it highlights the growing cost pressures created by the global imbalance between memory supply and demand. This article examines the key drivers behind the sharp increase in DRAM and NAND prices, including AI-driven demand for HBM and enterprise SSDs, the concentrated supply among the three leading memory manufacturers, the rapid rise of Chinese memory makers, and Apple's strategic evaluation of Chinese suppliers. It also explores how developments in the memory industry are reshaping the consumer electronics market and the future competitive landscape of the global supply chain.
- Industry
2026/7/14
Using ASML Equipment Orders to Gauge Capacity Trends in Logic and Memory Chips
ASML is the world's only company capable of mass-producing EUV lithography systems, making it the global leader in semiconductor manufacturing equipment and a key indicator of worldwide semiconductor capital spending and AI industry trends. This article explores ASML's position in the semiconductor industry, the differences between EUV and DUV technologies, and how demand for its equipment reflects capacity expansion in advanced process nodes and HBM. It also analyzes the company's latest financial performance, equipment orders, key takeaways from its earnings call, and the impact of AI, export controls, and global foundry investment on its future business outlook and the semiconductor industry cycle.
