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2026/7/28
Growing demand from AI servers, high-voltage power architectures, vehicle electrification, and industrial automation, combined with geopolitical developments and supply chain restructuring, has gradually shifted the Power semiconductors industry toward a seller’s market. This article examines the major power semiconductor product categories, end-use applications, and competitive landscape, while exploring how AI is driving higher demand for components such as MOSFETs, IGBTs, and SiC devices. It also assesses how Taiwanese suppliers, including PANJIT and APEC, may benefit from supply chain realignment.
# Stocks
# Taiwan
# Manufacturing Industry
# Semiconductors
# Electronics
# AI
# Automotive
2026/7/20
As demand for AI model training continues to surge, GPU computing power is evolving from a technology resource into a standardized, tradable asset, paving the way for the emergence of GPU compute futures. This article explains how GPU compute futures work, their role in hedging and risk management, and the value they bring to the market. It also explores how AI developers, data center operators, and financial institutions can use futures contracts to manage fluctuations in compute pricing, while highlighting the latest initiatives from exchanges such as CME Group and Intercontinental Exchange (ICE). Discover how the financialization of computing power is shaping the next frontier of the AI economy.
# Trading
# Financial Products
# Futures
# USA
2026/7/16
Apple's decision to raise prices for products including Macs and iPads reflects more than just a pricing strategy—it highlights the growing cost pressures created by the global imbalance between memory supply and demand. This article examines the key drivers behind the sharp increase in DRAM and NAND prices, including AI-driven demand for HBM and enterprise SSDs, the concentrated supply among the three leading memory manufacturers, the rapid rise of Chinese memory makers, and Apple's strategic evaluation of Chinese suppliers. It also explores how developments in the memory industry are reshaping the consumer electronics market and the future competitive landscape of the global supply chain.
# China
2026/7/14
ASML is the world's only company capable of mass-producing EUV lithography systems, making it the global leader in semiconductor manufacturing equipment and a key indicator of worldwide semiconductor capital spending and AI industry trends. This article explores ASML's position in the semiconductor industry, the differences between EUV and DUV technologies, and how demand for its equipment reflects capacity expansion in advanced process nodes and HBM. It also analyzes the company's latest financial performance, equipment orders, key takeaways from its earnings call, and the impact of AI, export controls, and global foundry investment on its future business outlook and the semiconductor industry cycle.
2026/7/8
An antitrust lawsuit against Samsung, SK hynix, and Micron has been accepted, alleging that the three leading memory manufacturers shifted production capacity from conventional DRAM to higher-margin HBM in response to booming AI demand. The plaintiffs claim this strategy has contributed to a roughly 700% increase in DRAM prices over the past four years. This article examines the key issues surrounding the lawsuit, explains how HBM capacity expansion is affecting memory supply and demand, and explores the oligopolistic structure of the DRAM market, the drivers behind soaring memory prices, and the potential implications for the memory industry and the broader AI supply chain.
2026/7/2
As computing power requirements for AI and HPC chips continue to rise, advanced packaging is shifting from wafer-level packaging toward panel-level packaging (PLP). This article explains PLP’s core technologies, the advantages of glass substrates and through-glass via (TGV) processes, and the differences between FOPLP and mainstream packaging technologies such as FOWLP, CoWoS, CoPoS, and EMIB. It also explores how demand for AI GPUs, chiplets, and heterogeneous integration is driving PLP market growth, while analyzing its future opportunities and technical challenges across the advanced packaging supply chain. Finally, this article highlights Taiwan's key companies involved in PLP technology and discusses their future outlook.
As Automate 2026 Chicago highlighted the next phase of smart manufacturing, with Physical AI emerging as the driving force behind industry transformation. From the development paths of wheeled and bipedal humanoid robots, to NVIDIA's Halos for Robotics safety system, as well as advances in simulation-first design, digital twins, AI vision, robotic touch sensing, and collaborative robots, the exhibition demonstrated that industry competition is no longer centered solely on hardware performance. Instead, it has expanded to include AI capabilities, hardware-software integration, and ecosystem development, making the event a key indicator of future trends in smart factories and industrial automation.
2026/6/24
Rapid growth in AI server demand is driving the passive components industry beyond its traditional inventory cycle and into a phase of structural growth. On the supply side, capacity expansion for high-end products remains limited, while longer lead times and ongoing price increases continue to emerge, pushing the industry firmly into a seller's market. This article examines how AI servers are reshaping the supply-demand dynamics of the passive components industry and explores the opportunities for Taiwanese companies such as Yageo and Holy Stone Enterprise.
2026/6/17
As demand for AI servers continues to surge, passive components have evolved from supporting components into a key area of market focus. From MLCCs and resistors to power inductors, these fundamental electronic components play a critical role in ensuring the stable operation of AI servers, GPUs, and high-speed data transmission systems. This article explores the major categories of passive components, their functions, and industry trends, while examining how the AI boom is creating opportunities for specification upgrades and long-term structural growth across the passive components industry.
# Editor's Pick
2026/6/9
As AI models continue to grow in scale, the competitive focus of data centers is shifting from GPU computing power to high-speed connectivity. At Computex 2026, Marvell highlighted that AI infrastructure is gradually entering the era of the “connectivity bottleneck,” where technologies such as optical interconnects, Co-Packaged Optics (CPO), silicon photonics, and high-speed SerDes will become critical enablers of future growth. This article summarizes Marvell’s perspective on the evolution of AI data center architectures and how optical connectivity is expected to drive the next wave of AI infrastructure innovation.
# Power Infrastructure
# Technology
# Communication Services
