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2025-09-09
As global demand for computing power surges, silicon photonics technology has emerged in response. Among its applications, Co-Packaged Optics (CPO) stands out as one of the most prominent extensions. This article provides an in-depth overview of the advantages of CPO and its critical components, including the silicon photonic engine, external lasers, fiber arrays, polarization-maintaining fibers, and MPO connectors. It also introduces several key companies involved in the field and outlines the major anticipated applications of CPO in the future.
# Stocks
# USA
# Taiwan
# Manufacturing Industry
# Editor's Pick
2025-08-26
Delta Electronics (2308) has evolved from a traditional electronic component manufacturer into a key player in the power supply market in recent years . This article outlines Delta’s four major business segments, global footprint, core clients, key competitors, and its future outlook. Delta stands to benefit from rising power demand driven by AI data centers. The company’s co-developed "Panama power architecture" , and water-cooling thermal management solutions have seen growing shipment volumes. Overall, Delta’s performance in AI-related products looks promising.
# Fundamental Analysis
2026-02-05
As AI and HPC chip sizes continue to expand rapidly, advanced packaging is facing multiple challenges, including area utilization efficiency, warpage control, and cost structure. Although traditional CoWoS technology has established a critical position in the high-performance computing market, the physical limitations of circular wafers and ABF substrates are gradually becoming more apparent, making panel-level packaging an inevitable next step. This article explains the development background and technical characteristics of CoPoS packaging, while also comparing the differences between CoPoS and earlier CoWoS and CoWoP technologies. By adopting square glass panels as the core of its CoPoS architecture, CoPoS addresses the needs of larger and more highly integrated packages through higher unit throughput and improved structural stability, while also driving a new wave of growth momentum across equipment makers and the broader supply chain.
2025-06-04
Whether it's DRAM for short-term data buffering or Flash for long-term data storage, memory has become an essential building block in electronic systems. This article introduces the two major categories of memory—volatile and non-volatile—and explains their respective characteristics and application scenarios. It concludes with an overview of prominent memory companies in Taiwan and around the world, analyzing their current production capacities as well as potential future trends and outlooks.
# Financial Lessons
2026-01-26
In 2026, the U.S. Federal Reserve (Fed) will undergo key leadership changes, including a full rotation of FOMC voting members and a transition of the Chair—developments that will have significant implications for future interest rate policy. The four new rotating voting members are generally hawkish, with broad support for slowing or pausing rate cuts in order to observe subsequent developments in inflation and the labor market. In contrast, potential candidates for the next Fed Chair lean more dovish, arguing that there is still room for further rate cuts. Overall, the 2026 FOMC is expected to feature a structure in which rotating voting members are relatively hawkish, while Governors and potential Chair candidates are more dovish. While markets continue to expect the overall direction of rate cuts to remain intact, the actual pace and magnitude will depend heavily on inflation trends, labor market data, and evolving political factors.
# Macroeconomics
# Central Bank
# Federal Reserve
2025-01-10
SoIC (System-on-Integrated-Chips) is a high-density 3D stacking packaging technology developed by TSMC, leveraging through-silicon vias (TSV) and hybrid bonding to enable higher performance and lower power consumption in chip designs. SoIC holds significant potential for applications in artificial intelligence (AI), high-performance computing (HPC), and autonomous driving. As production capacity continues to expand, SoIC is projected to become a mainstream next-generation semiconductor packaging technology.
# Investment
UC Capital is the Taiwanese firm that purchased the commemorative ball marking Shohei Ohtani’s 50 homers and 50 steals in a single season. Headquartered in Taipei, it is a quantitative proprietary trading firm. By focusing on high-frequency proprietary trading of Taiwanese stocks, ETFs, and derivatives, the firm—operating as a single quant fund—has become one of the leading institutional players in Taiwan’s financial markets. This article provides a brief introduction to the company and its investment strategies, along with an overview of its corporate culture and its strong performance in recent years.
# Investment Strategy
2025-12-15
The wafer production process includes design, front-end manufacturing, and back-end packaging and testing, with packaging being an essential step after wafer fabrication. This article provides an in-depth overview of the packaging industry's value chain—covering upstream packaging material suppliers, the differentiated business models of midstream wafer foundries, and downstream packaging service providers. It also briefly introduces key players at each stage. In addition to the value chain, the article discusses the current outlook and future prospects of the packaging industry, highlighting notable Taiwanese stocks such as TSMC (2330.TW) and Grand Process Technology (3131.TW).
2026-01-13
In 2026, the global economy is entering a new phase of “multi-speed and uneven” growth, with AI expected to remain a core engine driving macro momentum.In the U.S., consumption and employment continue to diverge. Sticky inflation and labor market restructuring are eroding the spending capacity of middle- and lower-income households, while credit risk is gradually surfacing. With limited room for rate cuts, market focus is shifting from valuation expansion to profitability and capital efficiency. AI investment is also moving from a “scale-first” to a “return-first” approach, with capital increasingly concentrated in players demonstrating sustainable, long-term competitiveness.
# Financial Planning
2026-02-03
After missing the surge in AI computing demand and facing setbacks in process-node execution, Intel is positioning its 18A node as a pivotal turning point to re-enter the advanced-manufacturing race. With core technologies such as RibbonFET (GAA) transistors, PowerVia backside power delivery, and High-NA EUV lithography, 18A not only carries hopes for a revival of Intel’s in-house processor roadmap, but is also viewed as a key bargaining chip for Intel Foundry Services to win tier-one customers. This article outlines the major technical elements and applications of the 18A process, compares Intel’s approach with TSMC and Samsung in the 2nm landscape, and assesses the challenges Intel may face going forward.
